Descrizione
Extruded aluminum heat sink for passive heat dissipation from power semiconductors and integrated circuits. It is suitable for mounting on a flat surface using thermal paste or thermal adhesive according to application requirements.
Technical specifications
Material: aluminum
Dimensions: 100 × 41 × 8 mm
Number of ribs: 26
Design: extruded profile
Purpose: passive heat sink for electronic components
Functions and features
Increased surface area due to fins for more efficient heat transfer to the surrounding air
Suitable for cooling ICs, memories, chipsets and other surface-contact components
Possibility of installation by gluing (thermally conductive adhesive) or mechanical attachment according to the device design
For proper operation, it is recommended to use thermally conductive material between the component and the heat sink.
Ideal for
Cooling of integrated circuits and power elements in compact devices
Electronic modules, power supplies, control units and prototype designs
Repairs and modifications to devices where heat dissipation from the chip or housing needs to be improved
Package contents
1 pc aluminum heatsink 100 × 41 × 8 mm
Why choose this product?
Standard aluminum heat sink with defined dimensions for easy integration into the design
Ribbed profile for passive cooling without the need for a fan
Suitable for a wide range of electronic applications requiring heat dissipation
Installation and operating instructions
Before assembly, clean the contact surfaces from dirt and grease.
Use thermal paste or thermal adhesive to reduce thermal resistance
Verify mechanical compatibility with surrounding components and airflow in the device
Safety notice
The heat sink may be hot during operation; provide protection against contact according to the device design.
When using thermally conductive adhesives, follow the manufacturer’s instructions and ensure adequate ventilation during application.
Recensioni
Ancora non ci sono recensioni.